摘要: As electronic packaging technology strives for miniaturization, integration, and multifunctionality, System in Package (SiP) technology faces new challenges. This study delves into Laser Jet Soldering Ball Bonding (LJSBB) technology as an alternative to traditional ball bonding techniques to reduce costs and enhance reliability. Using the method of controlling variables, the study systematically analyzed the impact of three key process parameters: laser power, heating time, and nozzle height, on the morphology of solder joints, coplanarity, and shear strength, revealing their mechanisms of influence. The experimental results indicate that increasing laser power and extending heating time can raise the temperature of the solder ball melt pool, causing the solder joints to flatten, directly affecting coplanarity; increasing nozzle height can make the solder ball move more violently upon contact with the pad, affecting its solidified shape and thus coplanarity. Additionally, it transforms the intermetallic compound (IMC) layer from a dispersed discontinuous state to a continuous thin layer, significantly enhancing the shear strength of the solder joints. Furthermore, through response surface experiments, the study analyzed the interactions between various process parameters. It verified the optimization results of the response surface, which were found to have a minimal error compared to actual values.